Die-Attach Paste Adhesives

Die-Attach Paste Adhesives

Description

Die-Attach Paste Adhesives

Die-attach paste adhesive is a type of adhesive material that is commonly used in the assembly of semiconductor devices. It is a viscous, paste-like material that is dispensed onto the substrate, and then the die is placed on top of the paste. The adhesive is then cured, typically through heat, which causes it to harden and create a strong bond between the die and the substrate.

Die-attach paste adhesive is typically made from a mixture of polymer resins, filler materials, and curing agents. The specific composition of the adhesive will depend on the requirements of the application, such as the size and weight of the die, the thermal and electrical properties required, and the bonding process used.

One advantage of using die-attach paste adhesive is that it can be dispensed with high precision, allowing for tight control over the amount and distribution of the adhesive. This can help to ensure that the die is securely attached to the substrate and that any voids or gaps in the bond line are minimized.

Die-attach paste adhesive is commonly used in a variety of semiconductor applications, including power electronics, LED packaging, and microelectronics. It is typically dispensed using automated equipment, such as dispensing robots or stencil printers, to ensure consistent and repeatable results.

Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear(psi) Tg (°C) Viscosity/ Thixotropic IndeX

One or two part component

<4x10-4 >5.7 >1,800 50 150,000(cps@ 0.5 rpm)

Solder replacement-

Stress free-Substrate/component

<4x10-4 >7.9 >1,500 -20 129,000(cps@ 0.5 rpm)

Solder replacement

Stress free

<4x10-4 >7.9 >2,000 -20 190,000(cps@ 0.5 rpm)

Stress free

Solvent free

<4x10-4 >7.9 >2,000 -20 354,000(cps@ 0.5 rpm)

Stress free

Solvent free

Large area die attach

<4x10-4 >7.9 >2,000 -20 255,000(cps@ 0.5 rpm)

Stress free

Large area die attach

<4x10-4 >7.9 >1,000 -20 130,000(cps@ 0.5 rpm)

Ideal for mismatched CTE’s

<4x10-4 >12.5 >1,200 -20 60,000(cps@ 0.5 rpm)

Solvent free

Designed to eliminate bleeding

<4x10-4 >7.9 >1,200 50 15,000(cps@ 0.5 rpm)

High green strength

Moisture resistant

<1x10-3 >7.9 >1,000 -55 40,000(cps@ 5 rpm)

Solvent free

Fine pitch

Rapid curing

<4x10-4 >8.6 >2,400 80 8,000(cps@ 5 rpm) TI >4.0

Solvent free

Fine pitch

Rapid curing for inline process

<5x10-4 >8.6 >2,400 80 15,000(cps@ 5 rpm) TI >4.0

Solvent free

Fine pitch

Rapid curing

<4x10-4 >3.6 >1,900 -40 8,000(cps@ 5 rpm) TI >4.0

Solvent free

Fine pitch

Rapid curing for inline process

<5x10-4 >7.9 >1,500 -20/-50 Minor 18,000(cps@ 5 rpm) TI >4.0

Stress free

High Green Strength

<5x10-4 >7.9 >1,000 -20/-50 minor 10,000(cps@ 5 rpm)

Solvent free

Withstands 350 Deg C

Low Moisture Absorption

Low Ionics

<5x10-2 >9 >2,500 240 65,000(cps@ 5 rpm)
Characteristics Electrical Resistivity(ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity

Stress free

One or two component

Large bonding areas

>1x1014 >1.7 >1,800 -20 300,000(cps@ 0.5 rpm)

Substrate attach

Large bonding areas

Bonding mismatched CTE’s

>1x1014 >3.67 >1,800 -25 337,000(cps@ 0.5 rpm)

Solvent free

Stress free

>1x1014 >1.7 >1,800 -25 275,000(cps@ 0.5 rpm)

Solvent free

Stress free

>1x1014 >3.6 >1,800 -25 245,000(cps@ 0.5 rpm)

Stress free

Mismatched CTE’s

>1x1014 >1.7 >2,400 -25 144,000(cps@ 0.5 rpm)

Stress free

High power die attach

>1x1014 >3.6 >1,800 -25 250,000(cps@ 0.5 rpm)

Stress free

Diamond filled

>1x1014 >11.4 >1,800 -25 310,000(cps@ 0.5 rpm)

Solvent free

Rapid inline curing

More than 7 days pot-life

>1x1014 >1.2 >3,200 60 38,000(cps@ 5 rpm) TI >3.0

Solvent free

Rapid inline curing

More than 7 days pot-life

>1x1014 >0.86 >1,200 -25 50,000(cps@ 5 rpm) TI >3.0

Stress free

Fast curing

>1x1014 >3.6 >1,200 -10 200,000(cps@ 0.5 rpm)

Solvent free

Low temperature curing

>1x1014 >1.7 >2,000 80 20,000(cps@ 5 rpm)

Solvent free

High Green Strength

>1x1013 >2.9 >1,500 -60 60,000(cps@ 5 rpm)

Solvent free

Withstands 350 Deg C

Low Moisture Absorption

Low Ionics

NA >1.0 >2,500 240 65,000(cps@ 5 rpm)

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